Volume 9, Issue 3 p. 302-313
Full Paper

Cuprous Oxide as a Potential Low-Cost Hole-Transport Material for Stable Perovskite Solar Cells

Bahram Abdollahi Nejand

Bahram Abdollahi Nejand

Nanomaterials Group, Dept. of Materials Engineering, Tarbiat Modares University, Tehran, Iran

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Prof. Vahid Ahmadi

Corresponding Author

Prof. Vahid Ahmadi

School of Electrical and Computer Engineering, Tarbiat Modares University, Tehran, Iran

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Saba Gharibzadeh

Saba Gharibzadeh

Department of Physics, Tarbiat Modares University, Tehran, Iran

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Prof. Hamid Reza Shahverdi

Prof. Hamid Reza Shahverdi

Nanomaterials Group, Dept. of Materials Engineering, Tarbiat Modares University, Tehran, Iran

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First published: 08 January 2016
Citations: 124

Graphical Abstract

New in town: The rotational angular deposition of Cu2O as a new hole-transport material for perovskite solar cells shows high surface coverage of the perovskite layer for a high rate of charge extraction. The engineered Cu2O layers show uniform, compact, and crack-free surfaces on the perovskite layer without affecting the perovskite structure. Deposition of Cu2O on a pinhole-free perovskite layer yields devices with a maximum power conversion efficiency of 8.93 %.

Abstract

Inorganic hole-transport materials are commercially desired to decrease the fabrication cost of perovskite solar cells. Here, Cu2O is introduced as a potential hole-transport material for stable, low-cost devices. Considering that Cu2O formation is highly sensitive to the underlying mixture of perovskite precursors and their solvents, we proposed and engineered a technique for reactive magnetron sputtering. The rotational angular deposition of Cu2O yields high surface coverage of the perovskite layer for high rate of charge extraction. Deposition of this Cu2O layer on the pinhole-free perovskite layer produces devices with power conversion efficiency values of up to 8.93 %. The engineered Cu2O layers showed uniform, compact, and crack-free surfaces on the perovskite layer without affecting the perovskite structure, which is desired for deposition of the top metal contact and for surface shielding against moisture and mechanical damages.